GENEVA, July 27 -- LAM RESEARCH CORPORATION filed a patent application (US2026/011274) for “HEATED VALVE FOR SEMICONDUCTOR PROCESSING TOOLS”. With publication no. WO/2026/156078, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 72/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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