GENEVA, Oct. 15 -- HANWHA SOLUTIONS CORPORATION filed a patent application (KR2026/004910) for “HEAT SINK STRUCTURE WITH ENCLOSURE AND GRAPHITE SHEET AND PRINTED CIRUIT BOARD ASSEMBLY INCLUDING THE SAME”. With publication no. WO/2026/216813, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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