GENEVA, Sept. 24 -- A.L.M.T. CORP. filed a patent application (JP2026/010618) for “HEAT SINK, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING HEAT SINK”. With publication no. WO/2026/197352, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/25
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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