GENEVA, July 2 -- SIEMENS ENERGY GLOBAL GMBH & CO. KG filed a patent application (EP2025/082351) for “HEAT PUMP CIRCUIT AND METHOD FOR OPERATING SUCH A CIRCUIT”. With publication no. WO/2026/130861, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F25B 6/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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