International Patent: HEAT DISSIPATION FIN, COOLING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING HEAT DISSIPATION FIN, METHOD FOR MANUFACTURING COOLING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, JIG, AND IDENTIFICATION DEVICE

GENEVA, Oct. 30 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2026/002173) for “HEAT DISSIPATION FIN, COOLING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING HEAT DISSIPATION FIN, METHOD FOR MANUFACTURING COOLING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, JIG, AND IDENTIFICATION DEVICE”. With publication no. WO/2026/225035, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: F28F 3/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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