GENEVA, Sept. 18 -- SIKA TECHNOLOGY AG filed a patent application (CN2025/081018) for “HEAT-CURING EPOXY RESIN COMPOSITIONS WITH IMPROVED ADHESION”. With publication no. WO/2026/183780, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 163/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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