GENEVA, June 19 -- PREGIS LLC filed a patent application (US2024/054304) for “HEAT-ACTIVATED MULTILAYER EMBOSSMENT”. With publication no. WO/2025/097083, here are the other details related to the patent application:
Kind: Correction of entry in Section I of the PCT Gazette [A8]
IPC: B65D 81/03
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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