International Patent: HARDWARE SECURITY MODULES INTEGRATED IN MEMORY DEVICES AND SYSTEMS

GENEVA, July 2 -- SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) filed a patent application (US2025/059717) for “HARDWARE SECURITY MODULES INTEGRATED IN MEMORY DEVICES AND SYSTEMS”. With publication no. WO/2026/136276, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 21/79

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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