International Patent: HARD-STOPS FOR FLIP-CHIP ARCHITECTURES, METHODS OF MANUFACTURING THE HARD-STOPS, AND CHIPS AND FLIP-CHIP ASSEMBLIES COMPRISING THE HARD-STOPS

GENEVA, Aug. 31 -- TECHNISCHE UNIVERSITEIT DELFT filed a patent application (EP2026/054536) for “HARD-STOPS FOR FLIP-CHIP ARCHITECTURES, METHODS OF MANUFACTURING THE HARD-STOPS, AND CHIPS AND FLIP-CHIP ASSEMBLIES COMPRISING THE HARD-STOPS”. With publication no. WO/2026/175972, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 72/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....