GENEVA, Aug. 14 -- KYOCERA CORPORATION filed a patent application (JP2026/004063) for “GRANULAR SEMICONDUCTOR SEALING RESIN COMPOSITION, RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME”. With publication no. WO/2026/168503, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 74/47
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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