INTERNATIONAL PATENT: FUKUDA METAL FOIL & POWDER CO., LTD., 福田金属箔粉工業株式会社 FILES APPLICATION FOR "SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD EACH USING SAID SURFACE-TREATED COPPER FOIL"

Posted On: 2026-04-28

GENEVA, April 28 -- FUKUDA METAL FOIL & POWDER CO., LTD. (176, Nakanono-cho, Matsubara-dori Muromachi Nishi-iru, Shimogyo-ku, Kyoto-shi, Kyoto6008435), 福田金属箔粉工業株式会社 (京都府京都市下京区松原通室町西入中野之町１７６番地) filed a patent application (PCT/JP2025/035837) for "SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD EACH USING SAID SURFACE-TREATED COPPER FOIL" on Oct 09, 2025. With publication no. WO/2026/083896, the details related to the patent application was published o...

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INTERNATIONAL PATENT: FUKUDA METAL FOIL & POWDER CO., LTD., 福田金属箔粉工業株式会社 FILES APPLICATION FOR "SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD EACH USING SAID SURFACE-TREATED COPPER FOIL"