INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "ETCHING SOLUTION, SUBSTRATE PROCESSING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD"

GENEVA, March 10 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2025/028537) for "ETCHING SOLUTION, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD" on Aug 12, 2025. With publication no. WO/2026/048520, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...