GENEVA, April 6 -- FUJI CORPORATION (19, Chausuyama, Yamamachi, Chiryu-shi, Aichi4728686), 株式会社ＦＵＪＩ (愛知県知立市山町茶碓山１９番地) filed a patent application (PCT/JP2024/034807) for "THREE-DIMENSIONAL MOLDING DEVICE, MOUNTING DEVICE, MANUFACTURING SYSTEM, THREE-DIMENSIONAL MOLDING METHOD, AND MOUNTING METHOD" on Sep 27, 2024. With publication no. WO/2026/069622, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...