International Patent: FRP PRECURSOR, FRP, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

GENEVA, July 31 -- RESONAC CORPORATION filed a patent application (JP2026/001725) for “FRP PRECURSOR, FRP, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/160351, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08J 5/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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