GENEVA, Aug. 14 -- SAM BU FINE CHEMICAL CO., LTD. filed a patent application (KR2025/010972) for “FORMING MOLD FOR SHOE UPPER WITH IMPROVED FORMING QUALITY USING CONCAVE AND CONVEX ENGAGEMENT METHOD”. With publication no. WO/2026/168662, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29D 35/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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