International Patent: FORMALDEHYDE-FREE ADHESIVE COMPOSITIONS AND METHODS OF USING THE SAME FOR ADHESION OF LIGNOCELLULOSIC MATERIALS

GENEVA, Aug. 14 -- SOLENIS TECHNOLOGIES CAYMAN, L.P. filed a patent application (US2026/014463) for “FORMALDEHYDE-FREE ADHESIVE COMPOSITIONS AND METHODS OF USING THE SAME FOR ADHESION OF LIGNOCELLULOSIC MATERIALS”. With publication no. WO/2026/170092, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 189/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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