GENEVA, Aug. 21 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/002711) for “FOLDABLE ELECTRONIC DEVICE COMPRISING SUPPORT PLATE”. With publication no. WO/2026/173445, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06F 1/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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