International Patent: FINAL POLISHING METHOD FOR WAFER, AND POLISHED WAFER

GENEVA, July 6 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. filed a patent application (CN2025/135696) for “FINAL POLISHING METHOD FOR WAFER, AND POLISHED WAFER”. With publication no. WO/2026/138261, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B24B 37/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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