GENEVA, July 2 -- RESONAC CORPORATION filed a patent application (JP2024/045052) for “FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SAME”. With publication no. WO/2026/133514, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/52
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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