GENEVA, July 2 -- RESONAC CORPORATION filed a patent application (JP2024/045278) for “FILM ADHESIVE FOR SEMICONDUCTORS AND MANUFACTURING METHOD THEREFOR, ADHESIVE TAPE AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD FOR COATING LIQUID”. With publication no. WO/2026/133557, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/52
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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