GENEVA, Sept. 7 -- RESONAC CORPORATION filed a patent application (JP2026/006893) for “FILM ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP PROVIDED WITH ADHESIVE LAYER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE”. With publication no. WO/2026/182074, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 74/15
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....