GENEVA, July 6 -- DIC CORPORATION filed a patent application (JP2025/040552) for “FIBER BUNDLING AGENT, FIBER BUNDLE, FORMING MATERIAL, AND FORMED PRODUCT”. With publication no. WO/2026/140615, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: D06M 15/564
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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