INTERNATIONAL PATENT: FERROTEC CORPORATION, 株式会社フェローテック FILES APPLICATION FOR "WAFER SUPPORT BODY AND METHOD FOR MANUFACTURING WAFER SUPPORT BODY"

GENEVA, March 30 -- FERROTEC CORPORATION (2-3-4, Nihonbashi, Chuo-ku, Tokyo1030027), 株式会社フェローテック (東京都中央区日本橋二丁目３番４号) filed a patent application (PCT/JP2025/031967) for "WAFER SUPPORT BODY AND METHOD FOR MANUFACTURING WAFER SUPPORT BODY" on Sep 10, 2025. With publication no. WO/2026/063309, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ...