International Patent: FABRICATION OF 3-DIMENSIONAL MULTI-LAYER ELECTRONICS BY DIRECT INK WRITING

GENEVA, Aug. 14 -- ELECTRONINKS INCORPORATED filed a patent application (US2026/014213) for “FABRICATION OF 3-DIMENSIONAL MULTI-LAYER ELECTRONICS BY DIRECT INK WRITING”. With publication no. WO/2026/169953, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09D 11/52

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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