GENEVA, July 27 -- SIKA TECHNOLOGY AG filed a patent application (EP2026/050719) for “EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY RESIN ADHESIVE WITH IMPROVED IMPACT RESISTANCE AND ADHESION”. With publication no. WO/2026/153945, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/42
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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