International Patent: ETCHING COMPOSITION, ETCHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

GENEVA, July 27 -- MITSUBISHI CHEMICAL CORPORATION filed a patent application (JP2025/046000) for “ETCHING COMPOSITION, ETCHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE”. With publication no. WO/2026/154992, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/64

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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