GENEVA, Oct. 30 -- ASAHI KASEI KABUSHIKI KAISHA filed a patent application (JP2026/015338) for “EPOXY RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME”. With publication no. WO/2026/225391, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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