International Patent: EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER

GENEVA, Aug. 21 -- SHIN-ETSU HANDOTAI CO., LTD. filed a patent application (JP2026/000434) for “EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER”. With publication no. WO/2026/172698, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 14/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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