International Patent: ENHANCED ASSEMBLY OF A 3D HETEROGENEOUS INTEGRATION PACKAGING STRUCTURE AND METHOD

GENEVA, Sept. 24 -- 3D GLASS SOLUTIONS, INC. filed a patent application (US2026/020063) for “ENHANCED ASSEMBLY OF A 3D HETEROGENEOUS INTEGRATION PACKAGING STRUCTURE AND METHOD”. With publication no. WO/2026/198857, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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