GENEVA, Sept. 24 -- YAMAHA ROBOTICS CO., LTD. filed a patent application (JP2026/004608) for “ENCAPSULATION MOLD AND COMPRESSION-MOLDING DEVICE”. With publication no. WO/2026/196867, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 43/36
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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