International Patent: EMBEDDED SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE

GENEVA, July 2 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC filed a patent application (US2025/025603) for “EMBEDDED SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE”. With publication no. WO/2026/135722, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/36

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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