GENEVA, June 19 -- LAM RESEARCH CORPORATION filed a patent application (US2025/054319) for “ELECTROSTATIC CHUCK WITH TOP SURFACE PATTERN FOR TEMPERATURE UNIFORMITY”. With publication no. WO/2026/106862, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 72/72
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....