GENEVA, July 1 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/020129) for “ELECTRONIC DEVICE INCLUDING BUTTON ASSEMBLY”. With publication no. WO/2026/127476, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06F 1/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....