International Patent: ELECTRONIC DEVICE COMPRISING ACOUSTIC MULTILAYER MESH ASSEMBLY

GENEVA, June 24 -- HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED filed a patent application (CN2024/135639) for “ELECTRONIC DEVICE COMPRISING ACOUSTIC MULTILAYER MESH ASSEMBLY”. With publication no. WO/2026/112957, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04R 1/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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