International Patent: ELECTRONIC DEVICE, PACKAGING STRUCTURE, CHIP STACKING STRUCTURE, CHIP AND MANUFACTURING METHOD

GENEVA, Oct. 30 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2026/091991) for “ELECTRONIC DEVICE, PACKAGING STRUCTURE, CHIP STACKING STRUCTURE, CHIP AND MANUFACTURING METHOD”. With publication no. WO/2026/223631, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 74/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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