GENEVA, Sept. 7 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/129248) for “ELECTRONIC DEVICE, HOUSING STRUCTURE OF ELECTRONIC DEVICE, AND MANUFACTURING METHOD”. With publication no. WO/2026/179189, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04M 1/18

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....