International Patent: ELECTRONIC APPARATUS COMPRISING INTERCONNECTED PRINTED CIRCUIT BOARDS AND MANUFACTURING METHOD THEREFOR

GENEVA, June 24 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/015639) for “ELECTRONIC APPARATUS COMPRISING INTERCONNECTED PRINTED CIRCUIT BOARDS AND MANUFACTURING METHOD THEREFOR”. With publication no. WO/2026/116744, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 3/36

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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