International Patent: ELECTRICALLY CONNECTING A FLEXIBLE CIRCUIT TO A SUPPORT STRUCTURE

GENEVA, Sept. 7 -- TERADYNE, INC. filed a patent application (US2026/016346) for “ELECTRICALLY CONNECTING A FLEXIBLE CIRCUIT TO A SUPPORT STRUCTURE”. With publication no. WO/2026/183056, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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