GENEVA, Sept. 18 -- LANDIS+GYR TECHNOLOGY, INC. filed a patent application (US2026/018087) for “ELECTRICALLY-CONDUCTIVE SLEEVE AND METHOD FOR MAKING ELECTRICAL CONTACT WITH CIRCUIT BOARD VIA CONDUCTIVE SLEEVE”. With publication no. WO/2026/188144, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01R 12/58
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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