GENEVA, May 5 -- EGTM CO., LTD. (219-9, Maeyeong-ro, Yeongtong-guSuwon-siGyeonggi-do 16523), 주식회사 이지티엠 (경기도수원시영통구 매영로 219-9) filed a patent application (PCT/KR2025/017013) for "METHOD OF FORMING THIN FILM BY USING PI-BONDING MATERIAL" on Oct 23, 2025. With publication no. WO/2026/089544, the details related to the patent application was published on Apr 30, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CHO, Kyu Ho ((Woncheon-dong, Yeongtong innoplex) 3...