GENEVA, April 19 -- EEJA LTD. (2-6-6 Nihonbashi Kayabacho, Chuo-ku, Tokyo1030025), ＥＥＪＡ株式会社 (東京都中央区日本橋茅場町二丁目６番６号) filed a patent application (PCT/JP2025/034314) for "PRIMER RESIN SOLUTION FOR ELECTROLESS PLATING, METHOD FOR PLATING THROUGH HOLE-INCLUDING GLASS SUBSTRATE USING SAID PRIMER RESIN SOLUTION, AND GLASS INTERPOSER SUBSTRATE" on Sep 29, 2025. With publication no. WO/2026/079181, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification ...