INTERNATIONAL PATENT: EBARA CORPORATION, 株式会社荏原製作所 FILES APPLICATION FOR "SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE"

GENEVA, April 28 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2025/020139) for "SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE" on Jun 04, 2025. With publication no. WO/2026/083630, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FUJIKATA, Jumpei (c/o Ebara Corp...