GENEVA, July 31 -- LINTEC CORPORATION filed a patent application (JP2026/001678) for “EASILY DISASSEMBLING ADHESIVE SHEET, LAMINATED STRUCTURE, DISASSEMBLY METHOD, AND USAGE METHOD”. With publication no. WO/2026/160340, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 7/38
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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