International Patent: DUPLEX PATTERN CONFIGURATIONS FOR TIME DIVISION DUPLEX PATTERNS AND SUB-BAND FULL DUPLEX PATTERNS

GENEVA, Sept. 24 -- QUALCOMM INCORPORATED filed a patent application (US2026/014525) for “DUPLEX PATTERN CONFIGURATIONS FOR TIME DIVISION DUPLEX PATTERNS AND SUB-BAND FULL DUPLEX PATTERNS”. With publication no. WO/2026/198183, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 5/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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