International Patent: DUAL-CHIP CARD STRUCTURE BASED ON ELECTRICAL SHIELDING LAYER

GENEVA, July 1 -- SHANGHAI HELI TECHNOLOGY CO., LTD. filed a patent application (CN2025/137973) for “DUAL-CHIP CARD STRUCTURE BASED ON ELECTRICAL SHIELDING LAYER”. With publication no. WO/2026/124220, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06K 19/077

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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