GENEVA, Aug. 7 -- BASF SE filed a patent application (EP2026/052270) for “DMSO-FREE PHOTORESIST STRIPPING SOLUTION FOR REMOVING THICK PHOTORESIST”. With publication no. WO/2026/162610, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/42
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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