GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/060152) for “DIGITAL TWIN-ASSISTED VALIDATION FOR POSITIONING MEASUREMENTS AND AI/ML POSITIONING”. With publication no. WO/2026/151586, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04L 67/52
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....