GENEVA, Aug. 14 -- GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE filed a patent application (US2026/014207) for “DIELECTRIC-GAPPED ELECTROMAGNETIC CONDUCTIVE INTERCONNECT”. With publication no. WO/2026/169948, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G08C 17/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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