International Patent: DIE TRANSFER DEVICE, DIE LEVEL TEST SYSTEM INCLUDING SAME, AND METHOD FOR CONTROLLING DIE TRANSFER DEVICE

GENEVA, July 9 -- SEMICS INC. filed a patent application (KR2025/023037) for “DIE TRANSFER DEVICE, DIE LEVEL TEST SYSTEM INCLUDING SAME, AND METHOD FOR CONTROLLING DIE TRANSFER DEVICE”. With publication no. WO/2026/147141, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 31/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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