GENEVA, Aug. 7 -- ASML NETHERLANDS B.V. filed a patent application (EP2025/088154) for “DIE-TO-WAFER BONDING PROCESS”. With publication no. WO/2026/162226, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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